Ion Beam Cones

SIKAIDA Ion Beam Cones are core components of ion beam implantation and transmission systems. Made from high-purity advanced ceramic materials and processed through precision injection molding and high-temperature sintering, they feature extremely low impurity content, high temperature resistance, and stable dimensional accuracy. They can be machined into complex geometries to meet extremely high tolerance requirements, making them suitable for high-performance semiconductor ion implantation processes.

As a professional manufacturer in China, SIKAIDA provides reliable, cost-effective, and customizable ion beam cones to customers worldwide in the semiconductor, flat panel display, optics, microelectromechanical systems (MEMS), and solar energy fields. SIKAIDA is a trusted long-term supplier and dedicated manufacturing plant for high-end ion beam process components.

Materials and Manufacturing

1. Materials

Ion Beam Cones uses materials including alumina (Al₂O₃) with a purity ≥99.9%, silicon nitride (Si₃N₄) with a purity ≥99.5%, zirconium oxide (ZrO₂) with a purity ≥99.8%, and fused silica (99.999%). All materials meet the stringent purity standards of the semiconductor industry and are suitable for the performance requirements of various applications.

2. Manufacturing Process

The manufacturing process encompasses precision injection molding, high-temperature sintering, CNC precision machining, mirror-level polishing, and automated cleaning and testing. Each process is strictly controlled for precision and quality to ensure that the final product meets industry standards and customer requirements.

Key Product Parameters

1. Dimensional Accuracy

Ion Beam Cones have tolerances controlled within ±0.05mm, surface roughness Ra≤0.4μm, internal hole taper accuracy ±0.02mm, coaxiality ≤0.03mm, and perpendicularity ≤0.02mm. This extremely high dimensional accuracy effectively ensures the precision of ion beam transmission.

2. Surface Treatment

Surface treatments include mechanical polishing for a mirror finish, UV-cured coatings to enhance surface properties, scratch-resistant coatings to improve wear resistance, and acid pickling and passivation to remove impurities and improve stability. Appropriate treatment methods can be selected based on application requirements.

3. Performance Indicators

Ion Beam Cones operate within a temperature range of -196℃ to +800℃, ensuring stable operation in extreme temperature environments. They possess a volume resistivity ≥10¹⁴Ω·cm and a surface resistivity ≥10¹²Ω, exhibiting excellent insulation properties. They also possess outstanding resistance to plasma and chemical corrosion, allowing them to adapt to complex process environments.

Core Advantages

1. Ultra-high Purity: Raw material purity exceeds 99.9%, minimizing contamination of semiconductor wafers, ensuring stable electrical performance of devices, and meeting the stringent purity requirements of semiconductor manufacturing.

2. Extremely High Geometric Accuracy: Ensures consistent product dimensions during mass production, with taper error controlled within ±0.05mm and roundness error ≤0.02mm, precisely matching the installation and usage requirements of ion beam transmission systems.

3. Mirror-like Surface Quality: Surface roughness Ra≤0.4μm, effectively reducing ion beam scattering, improving the uniformity of ion beam transmission, and further optimizing the implantation accuracy of semiconductor devices.

4. Wide Temperature Range Stability: Operates stably in deep cryogenic to high-temperature environments. The material has an extremely low coefficient of thermal expansion, maintaining excellent dimensional stability even with temperature changes, preventing performance impacts from temperature fluctuations.

5. Excellent Insulation and Corrosion Resistance: Effectively prevents charge accumulation during ion beam transmission and withstands strong acids, strong alkalis, and various plasma corrosions, ensuring long-term stable operation in complex process environments.

Customized Services

Product models and sizes can be customized according to different process requirements. Supported drawing formats include STP, STEP, IGS, XT, DXF, DWG, PDF, and physical samples. Regarding delivery time, sample delivery is 4-7 weeks, and batch product delivery is 8-12 weeks. Our quality system complies with ISO9001:2015, SGS RoHS, REACH, and SEMI standards, comprehensively ensuring product quality and delivery efficiency.

Application Areas

Ion Beam Cones are widely used in multiple fields, including ion implanters in semiconductor manufacturing, processing equipment in flat panel displays, ion beam deposition (IBD) and ion beam etching (IBE) systems in optical device manufacturing, microelectromechanical systems (MEMS) manufacturing, ion doping equipment for solar cells, and ion implantation processes for power semiconductor devices such as insulated-gate bipolar transistors (IGBTs) and power MOSFETs.

Frequently Asked Questions:

Q1: What materials are typically used in Ion Beam Cones?

A1: We primarily use advanced ceramic materials such as high-purity alumina (Al₂O₃), silicon nitride (Si₃N₄), and zirconium oxide (ZrO₂). These materials possess extremely high purity, excellent high-temperature resistance, and stable electrical properties.

Q2: Can UET provide customized specifications and surface treatments? 

A2: Yes. UET can customize the size, taper, material type, and surface treatment of the cones according to your process requirements. We have extensive manufacturing experience and can meet customers' specific application requirements.

Q3: How is the precision and quality of Ion Beam Cones guaranteed?

A3: We adopt the ISO9001:2015 quality management system and are equipped with high-precision testing equipment, including a coordinate measuring machine, surface roughness tester, and X-ray fluorescence spectrometer, to ensure that every batch of products meets stringent industry standards.

Q4: What is the delivery cycle?

A4: The sample delivery cycle is 4-7 weeks, and the batch product delivery cycle is 8-12 weeks. The specific cycle depends on the product complexity and order quantity.